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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Finite Element Predictions of Free Convection Heat Transfer Coefficients of Simulated Electronic Circuit Boards
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A numerical simulation of the buoyancy-induced flow around microelectronic components mounted on a circuit board has been performed using the finite element method. The circuit board is modeled ...