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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Reducing Inter-Chip Temperature Differences in Computers Using Vortex Generators in Forced Convection
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Experiments were conducted to investigate methods of reducing inter-chip temperature differences in forced convective direct immersion cooling of semiconductor chips using a dielectric liquid (FC-77) ...