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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Thermal Solution Maps: A Strategy for Thermal Design of Three-Dimensional Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Three-dimensional (3D) packages are of considerable interest at the present time as a means for heterogeneous high-performance integration of disparate digital, analog, optical, and MEMS technologies. ...