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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Singularities at Solder Joint Interfaces and Their Effects on Fracture Models
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this study, we focus on investigating the nature of the stress and strain behavior in solder joints and their effect on the hybrid damage modeling approach, which is inspired by cohesive ...
Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical Fits
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Predicting the fatigue life of solder interconnections is a challenge due to the complex nonlinear behavior of solder alloys, the importance of the load history, and the wide variation in ...