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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Numerical Modeling of Forced Convection Heat Transfer for Modules Mounted on Circuit Boards
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Numerical simulation of the fluid and heat transfer characteristics of electronic modules mounted on circuit boards is performed using a commercial finite-control-volume code, PHOENICS. The model ...
Thermal Model of a PC
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents an alternative approach to modeling box cooling in electronic packages. A finite-control-volume simulation code is used to simulate an IBM desktop Personal Computer. Only the ...