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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Misaligned Flip-Chip Solder Joints: Prediction and Experimental Determination of Force-Displacement Curves
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The results of wetting experiments between eutectic lead-tin solder and copper pads on silicon substrates in geometries relevant to flip-chip applications are presented. Measurements of solder ...