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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-6 of 6
Viability of Dynamic Cooling Control in a Data Center Environment
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Data center thermal management challenges have been steadily increasing over the past few years due to rack level power density increases resulting from system level compaction. These challenges ...
From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: To achieve reductions in the power consumption of the data center cooling infrastructure, the current strategy in data center design is to increase the inlet temperature to the rack, while the ...
From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The chiller cooled data center environment consists of many interlinked elements that are usually treated as individual components. This chain of components and their influences on each other ...
From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiencyor1
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In the drive to enhance data center energy efficiency, much attention has been placed on the prospect of airflow containment in hot-aisle cold-aisle raised floor arrangements. Such containment ...
From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The power consumption of the chip package is known to vary with operating temperature, independently of the workload processing power. This variation is commonly known as chip leakage power, ...
An Exergy-Based Figure-of-Merit for Electronic Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Chip power consumption and heat dissipation have become important design issues because of increased energy costs and thermal management limitations. As a global compute utility evolves, seamless ...