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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Thermal Management Strategies for Embedded Electronic Components of Wearable Computers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Wearable computers are rugged, portable computers that can be comfortably worn on the body and easily operated for maintenance applications. The recently developed process of Shape Deposition ...
Influence of Pulsating Submerged Liquid Jets on Chip-Level Thermal Phenomena
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this study, numerical investigations are performed to examine the influence of unsteady submerged dielectric liquid (HFE-8401HT) jets impinging on electronic chip surfaces. The problem considered ...