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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Fluid-to-Fluid Spot-to-Spreader (F2/S2) Hybrid Heat Sink for Integrated Chip-Level and Hot Spot-Level Thermal Management
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An innovative heat sink design aimed at meeting both the hot spot and large background heat flux requirements of next generation integrated circuits is presented. The heat sink design utilizes ...