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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Far Back End of Line Aluminum Stress Reduction Methods for Two-Dimensional/2.5D Fine Pitch Assemblies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Fine pitch interconnects when used with two-dimensional (2D)/2.5D packaging technology offer enormous potential toward decreasing signal latency and by making it possible to package increased electrical functionality within ...