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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Design Parameters and Practical Considerations in the Two-Phase Forced-Convection Cooling of Multi-Chip Modules
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Forced-convection boiling was investigated with a dielectric coolant (FC-72) in order to address some of the practical issues related to the two-phase cooling of multi-chip modules. The module ...