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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Carrier Mobility Shift in Advanced Silicon Nodes Due to Chip-Package Interaction
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Potential challenges with managing mechanical stress and the consequent effects on device performance for advanced three-dimensional (3D) integrated circuit (IC) technologies are outlined. The growing need for a simulation-based ...