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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Sequential Reflow Process Optimization to Reduce Die Attach Solder Voids
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Solder voids are detrimental to the thermal, mechanical, and reliability performance of integrated circuit (IC) packages and must be controlled within certain specifications. A sequential method of optimizing solderreflow ...