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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Intrinsic Strain Modeling and Residual Stress Analysis for Thin-Film Processing of Layered Structures
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Residual stresses develop due to intrinsic and extrinsic strains that form during the processing. Extrinsic strains can be determined using coefficient of thermal expansion, material properties, ...