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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Thermo-Viscoelastic Analysis of Deflection in CSP Electronic Device Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In the present paper, a deformation induced in a new bonding technology of chip-scale package (CSP) using resin encapsulation sheets is examined numerically and experimentally. Deflections after ...