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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Thermoplastic Finite Element Analysis of Unfilled Plated-Through Holes During Wave Soldering
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Previous related research has not developed a consensus on the issue of how stress analyses of plated-through hole (PTH)/printed wiring board (PWB) structure subject to uniform temperature change ...