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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Warpage Analysis of Underfilled Wafers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Wafer-level packaging (WLP) is one of the future trends in electronic packaging. Since 1994, many companies have released various WLP licenses. One of the common concerns of WLP is wafer ...