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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Design and Fabrication of Leadless Package Structure for Pressure Sensors
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Silicon piezoresistive pressure sensors can only operate below 125 °C due to the leakage current of the PN junction. However, silicon-on-insulator (SOI) high-temperature pressure sensors use SiO2 for total dielectric ...