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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Due to low cost and good electrical performance, wafer-level chip scale packaging (WLCSP) has gained more attention in both industry and academia. However, because the coefficient of thermal expansion (CTE) mismatches ...