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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Thermal Strain Measurements of Solder Joints in Second Level Interconnections Using Moire Interferometry
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Low cycle fatigue of solder joints is one of the major kinds of failures in second level interconnections of an electronic package. The fatigue failure is caused by thermal strains which are ...