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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-3 of 3
Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A nonlinear finite element modeling (FEM) scheme to analyze the combined effect of thermal and hygroscopic deformation is presented. The scheme employs the conventional moisture diffusion, heat ...
Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We propose an advanced thermal-moisture analogy scheme to cope with the inherent limitations of the existing analogy schemes. The new scheme is based on the experimentally observed unique ...
Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this work, a new experimental methodology for analyzing the drop impact response is assessed using a pair of high-speed digital cameras and 3D digital image correlation software. Two different ...