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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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An Investigation of Stresses Induced by Temperature Variation in Integrated Circuit Molding Process
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A molding model is established in this study based on a real integrated circuit for simulating the molding process. This paper presents both the temperature distribution and the thermal stress ...