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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Study on the Die-Attach Voids Distribution With X-Ray and Image Processing Techniques
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Power electronic components' reliability depends, to a great extent, on the quality of die-attach technology. The voids appearance in the die-attach regions is almost unavoidable during the manufacturing process. The aim ...
Study on the Die-Attach Voids Distribution With X-Ray and Image Processing Techniques
Publisher: American Society of Mechanical Engineers (ASME)
Abstract: Power electronic components' reliability depends, to a great extent, on the quality of die-attach technology. The voids appearance in the die-attach regions is almost unavoidable during the manufacturing process. The aim ...