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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-5 of 5
Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Multi-layered stacks are commonly used in microelectronic packaging. Traditionally, these systems are designed using linear-elastic analysis either with analytical solutions or finite element method. ...
Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An accurate estimate of thermal stresses in multilayered microelectronics structures along the bonded interfaces is crucial for design and prediction of delamination-related failures. Compared with ...
Thermomechanical Analysis of Solder Joints Under Thermal and Vibrational Loading
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Due to the coefficient of thermal expansion (CTE) mismatch between the bonded layers, the solder joint experiences cycling shear strain, which leads to short cycle fatigue. When semiconductor ...
A Damage Mechanics-Based Fatigue Life Prediction Model for Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A thermomechanical fatigue life prediction model based on the theory of damage mechanics is presented. The damage evolution, corresponding to the material degradation under cyclic thermomechanical ...
Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The reliability of solder joints in electronic packaging is becoming more important as the ball grid array (BGA) develops rapidly into the most popular packaging technology. Thermal fatigue of ...