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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Molecular Dynamics Simulation of Thermal Cycling Test in Electronic Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Interfacial failure under thermal cycling conditions is one of the main concerns in package design. To minimize such failure in multi-layered electronic assemblies and packages, it is important ...