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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Flow Structure and Enhanced Heat Transfer in Channel Flow With Dimpled Surfaces: Application to Heat Sinks in Microelectronic Cooling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The use of dimple technology for improvement in friction factors and enhancement of heat transfer has been attracting the attention of many scientists and engineers. Numerical and experimental ...