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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Thermal Resistance Analysis of Sn Bi Solder Paste Used as Thermal Interface Material for Power Electronics Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: To promote heat dissipation in power electronics, we investigated the thermal conduction performance of SnBi solder paste between two Cu plates. We measured the thermal resistance of SnBi solder paste used as thermal ...
High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The technology of fan-out wafer level packaging (FOWLP) has been widely adopted for millimeter wave antenna-in-package (AiP) system integration with low interconnection parasitic parameters. Present AiP solutions using ...