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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Investigation of the Lead-On-Chip Package’s Reliability
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An assembly test chip (ATC), consisting of varieties of test structures, had been utilized to monitor the package integrity of SOJ lead-on-chip (LOC) packages after various reliability tests. ...