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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Study of Print Release Process in Solder Paste Printing
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Solder paste printing is central to the mass reflow soldering process for surface mount technology. The miniaturization of components has put an increased demand on the printing process and ...
Determination of Parameters Affecting Solder Paste Tack Strength as Measured in the IPC Tack Test: A Classical Design of Experiments Approach
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Solder paste is used in the electronics industry to connect surface mount circuit components to printed wiring boards. A printed wire board (PWB) is populated with components by applying solder ...