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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
An Overview of Integrated Circuit Device Encapsulants
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The rapid development of integrated circuit technology from small-scale integration (SSI) to very large scale integration (VLSI) has had great technological and economical impact on the electronics ...
High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper describes the development and characterization of anisotropically conductive films (ACFs) incorporated with copper (Cu) particles as electrically conductive fillers for environmentally ...