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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Alternative Curing Methods for FCOB Underfill
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper explores the use of liquid immersion and vapor condensation curing as alternatives to conventional hot air oven curing of flip chip on board underfill. Heat transfer results suggest ...