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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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An Analytical Cure Model for Underfill Epoxies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An analytical model relating the degree of cure of an underfill epoxy to the heat transfer coefficient of the heating process and time is presented. The model was verified experimentally by ...