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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Impact Resistance of SM Joints Formed With ICA
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Isotropic conductive adhesives (ICA) have been considered as replacement materials for lead-tin solder alloys. In this paper, the post-impact shear strength of ICA surface mount (SM) joints was ...
Impact Resistance of SM Joints Formed With ICA
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Isotropic conductive adhesives (ICA) have been considered as replacement materials for lead-tin solder alloys. In this paper, the post-impact shear strength of ICA surface mount (SM) joints was ...