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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Heat Transfer Behavior for a Stationary or Rotating MCM Disk With an Unconfined Round Jet Impingement
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A series of experimental investigations on the studies related to fluid flow and transient mixed convection from a horizontally unconfined stationary or rotating ceramic-based multichip module ...
Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An effective method for performing the thermal optimization of stationary and rotating multichip module (MCM) disks with an unconfined round-jet impingement under space limitation constraint has ...