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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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A Model for Assessing the Shape of Solder Joints in the Presence of PCB and Package Warpage
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Our goals in this paper are to develop and demonstrate a computationally efficient methodology for assessing the effect of circuit board warpage, component warpage, and solder volume variation ...