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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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A Finite Element Procedure of a Cyclic Thermoviscoplasticity Model for Solder and Copper Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A finite element procedure using a semi-implicit time-integration scheme has been developed for a cyclic thermoviscoplastic constitutive model for Pb-Sn solder and OFHC copper, two common metallic ...