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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Computational Modeling and Validation of the Encapsulation of Plastic Packages by Transfer Molding
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents, discusses, and compares results from experimental and computational studies of the plastic encapsulation process for a 144-lead TQFP package. The experimental results were ...