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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-4 of 4
Translation of Stress States Into Reliability Terms for Single Chip Ceramic Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper addresses the gap between optimistic and pessimistic analytical predictions of the reliability of microelectronic structures using the example of single chip ceramic packages. The ...
The Mechanics of the Edge Delamination Test
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A new test to measure the adhesion of thin polymeric coatings (the so-called “edge delamination test”) has been recently proposed by Shaffer et al. (1993), where the authors translate the test ...
Impact of Tapering on Interfacial Stresses
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The reduction of interfacial thermal stresses is estimated for a bimaterial strip tapered at the edges. Simple equations for this stress reduction are proposed.
Discussion: Notes on Microelectronics Packaging Handbook by Rao Tummala and Eugene Rymaszewski, Van Nostrand, 1988
Publisher: The American Society of Mechanical Engineers (ASME)