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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-3 of 3
Lead-On-Chip Versus Chip-On-Lead Packages and Solder Failure Criteria
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: High impact of peeling stresses on solder joint reliability, and how to account for these stresses in failure criteria, are discussed. [S1043-7398(00)00803-3]
Impact of Low Temperatures on Solder Joint Failures
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An experiment with solder joints of thin plastic packages, cycled between −10° and 110°C, has demonstrated that the majority of solder joint failures occurred at the low temperatures. ...
A Cause of Cracking in the Under-Bump-Metallurgy Area of Flip Chips
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Plastic compressive deformation of the copper layer at high temperatures is a significant contributor for die cracking in the under-bump-metallurgy (UBM) area of flip chips.