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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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A Mechanistic Model for Solder Joint Failure Prediction Under Thermal Cycling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A mechanistic model for eutectic Pb/Sn solder life predictions has been developed and applied to leadless surface mount solder joints. This model can quantitatively describe both crack initiation ...