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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Die Cracking at Solder (In60-Pb40) Joints on Brittle (GaAs) Chips: Fracture Correlation Using Critical Bimaterial Interface Corner Stress Intensities
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We study cracking from the interface of an In60-Pb40 solder joint on a brittle GaAs die when the joint is subjected to a uniform temperature change. Our primary objective is to apply and ...