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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Special Issue on Poly’2000, London
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Experts from the Polymeric Materials community from four continents met in December, 2000 at the Third International Workshop, Poly’2000 in London. The Poly conference series is sponsored by ...
Reliability Prediction of Area Array Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Packages for high pin counts using the ball grid array technology or its miniaturized version, the chip scale package, inherently require reliability concepts as an integral part of their ...