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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Mechanical Characterization of Thermal Interface Materials and Its Challenges
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal interface materials (TIMs) play a vital role in the performance of electronic packages by enabling improved heat dissipation. These materials typically have high thermal conductivity and are designed to offer a ...
Mechanical Characterization of Thermal Interface Materials and Its Challenges
Publisher: American Society of Mechanical Engineers (ASME)
Abstract: Thermal interface materials (TIMs) play a vital role in the performance of electronic packages by enabling improved heat dissipation. These materials typically have high thermal conductivity and are designed to offer a ...