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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Analytical Thermo-Mechanical Model for Non-Underfilled Area Array Flip Chip Assemblies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An analytical model is derived for the calculation of thermo-mechanical induced stresses in area array flip chip assemblies. This analytical model is based on structural mechanics and has the ...
Parameterized Modeling of Thermomechanical Reliability for CSP Assemblies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Finite element modeling is widely used for estimating the solder joint reliability of electronic packages. In this study, the electronic package is a CSP mounted on a printed circuit board ...