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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Assessment of Joule Heating and Temperature Distribution on Printed Circuit Boards Via Electrothermal Simulations
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A printed circuit board (PCB) comprises a solid piece of dielectric material with embedded layers of current carrying metal traces and vias. Geometric features of these metal traces and vias in modern PCBs are highly ...