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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Multiscale Transient Thermal Analysis of Microelectronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In a microelectronic device, thermal transport needs to be simulated on scales ranging from tens of nanometers to hundreds of millimeters. High accuracy multiscale models are required to develop engineering tools for ...
Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The high current densities in today's microelectronic devices and microchips lead to hotspot formations and other adverse effects on their performance. Therefore, a computational tool is needed to not only analyze but also ...