Search
Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-3 of 3
Three Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper reports on novel thermal testbeds with embedded micropinfin heat sinks that were designed and microfabricated in silicon. Two micropinfin arrays were presented, each with a nominal pin height of 200 خ¼m and ...
Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As integration levels increase in next generation electronics, high power density devices become more susceptible to hotspot formation, which often imposes a thermal limitation on performance. Flow boiling of R134a in two ...
Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Three-dimensional (3D) stacked integrated circuit (SIC) chips are one of the most promising technologies to achieve compact, high-performance, and energy-efficient architectures. However, they face a heat dissipation ...