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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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An Experimental and Computational Study on Moisture Induced Epoxy Swelling in Non-hermetic Optoelectronic Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Moisture induced epoxy swelling is a potential failure mechanism in nonhermetic packages. Epoxy materials used in the package absorb moisture and swell in a relatively humid environment. This ...