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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Monitoring Fatigue Cracking in Interconnects in a Ball Grid Array by Measuring Electrical Resistance
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In displacement controlled mechanical fatigue of ball grid solder interconnect arrays, decrease in maximum load monitors total increase in crack area in an array while electrical resistance ...