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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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A Scalable Multi-Functional Thermal Test Chip Family: Design and Evaluation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Nowadays, thermal characterization of IC packages and packaging technologies is becoming a key task in thermal engineering. To support this by measurements, we developed a family of thermal test ...